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Microelectronic Packaging

Microelectronic Packaging by M. Datta
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Electrochemical Processing Technologies and their Impact in Microelectronic Packaging, Madhav Datta

Electroplating Process for Cu Chip Metallization, Valery M. Dubin, Harsono S. Simka, Sadasivan Shankar, Peter Moon, Thomas Marieb, and Madhav Datta

Electroless Barrier and Seed Layers for On-Chip Metallization, Valery M. Dubin, Sergey Lopatin, Amit Kohn, Nick Petrov, Moshe Eizenberg, and Yosi Shacham-Diamand

Alternative Materials for ULSI and MEMS Metallization, Yosi Shacham-Diamand, Nathan Croitoru, Alexander Inberg, Yelena Sverdlov, Valery Dubin, and Vadim Bogush

Tape Carrier and Development Trend, Osamu Yoshika, and Akira Chinda

Flip-chip Interconnection, Madhav Datta

Compliant Interconnects, Paul Kohl

Pb-free Flip-chip Technologies, D. R. Frear, and W.H. Lytle

Materials Overview in Organic Packaging, Saikumar Jayaraman, John Tang, and Vijay Wakharkar

Glass-Ceramic Packages, Kazuhiro Ikuina, Yuzo Shimada, and Kazuaki Utsumi

Electrochemical Processes in the Fabrication of Multi-chip Modules, S. Krongelb, L.T. Romankiw, E.D. Perfecto, and K.K.H. Wong

Bumping Technology for Advanced Packages, Shinichi Wakabayashi

Plated Through Hole Technology for Boards, Haruo Akahoshi

Electroplated Contact Materials for Connectors and Relays, Yutaka Okinaka

Chemical Mechanical Planarization: From Scratch to Planar, David K. Watts, Norio Kimura, and Manabu Tsujimura

Electrochemical Deposition Equipment, Tom Ritzdorf, and Dakin Fulton

Processes and Equipment for Wet Etching and Cleaning, Jeffery W. Butterbaugh
CRC Press; December 2004
563 pages; ISBN 9780203473689
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Title: Microelectronic Packaging
Author: M. Datta; Tetsuya Osaka; J. Walter Schultze
Buy, download and read Microelectronic Packaging (eBook) by M. Datta; Tetsuya Osaka; J. Walter Schultze today!