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Numerical Methods In Thermal Management Of Electronic Systems
A number of papers are presented covering the issues summarized in the preceding paragraph. The potential for handling ultra-high heat fluxes has spurred intensive research into micro-channel heat sinks. This issue has three papers dealing with the micro-channel heat sinks. The first paper by Liu and Garimella describes their current work on micro-channel heat sinks. A detailed computational fluid dynamics (CFD) model is used to obtain base line results against which a number of modeling approaches of increasing levels of complexity for the analysis of micro-channel heat sinks are compared. The results of the CFD model compared well with the experimental values. Practical optimization procedures are developed to minimize the overall thermal resistance of the micro-channel heat sinks based on the analytical models. The second paper is by Jeevan et al. in which they explore the thermal resistance of a stacked micro-channel heat sink. The thermal resistance is determined by one- and two-dimensional FEM approach. The minimum thermal resistance of stacked micro-channel is achieved by optimizing the channel configuration by using genetic algorithms. The third paper by Hegde et al. deals with the micro-channel heat sink in which boiling flow takes place. The disadvantage of the increase in the liquid temperature along the micro-channel is avoided when the two-phase flow takes place. It is observed that the thermal resistance of the micro-channel heat sink with boiling flows reduces considerably at the expense of the pressure drop. Thermal resistance reduces with increasing wall heat flux. These papers focus on the methods of determining the thermal resistance of micro-channel heat sinks for both single- and two-phase flows in addition to determine the optimum dimensions of the micro-channel heat sink for minimum thermal resistance.
The fourth paper by Ravi and Suresh deals with the application of CFD software FLUENTefor determining the thermal performance of a non-standard plastic quad flat package (PQFP) under natural convection environment. The simulated results compare well with the experimental data obtained in accordance with JEDEC Standards. This paper illustrates the way commercial software is used in an industrial environment before the product is finalized.
The fifth paper by Nithiarasu and Massarotti deal with the forced convection heat transfer from solder balls attached to a printed circuit board using the characteristic based split scheme (CBS) for both inline and staggered arrangements. They provide not only the results of the analysis against the angle of attack but also the details of the CBS scheme including the verification of a flow over a single sphere.
This special issue is concluded by a paper by Beh et al. in which the authors deal with the thermal performance of a triple stack cold plate used for cooling of electronic components. The paper highlights how a simple one-dimensional fin theory is applied to the stack to determine its performance under different operating conditions. A fast local transient method i.e. asymptotic waveform evaluation method is used here to predict the transient behaviour of the stack. The data provided in the paper will be helpful in the design of cold plates.
All of these papers highlight the application of heat and fluid flow in the cooling of
electronic components and systems. This special issue brings together some of the
most recent work addressing the details that are important in the thermal management
of electronic systems.
Previously published in: Personnel Review, Volume: 15, Number 1, 2005
115 pages; ISBN 9781845442361
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