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Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging by Yong Liu
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US$ 229.00
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Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP

Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations

Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practicioners can fully test their power electronic packaging designs




Springer New York; February 2012
605 pages; ISBN 9781461410539
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Title: Power Electronic Packaging
Author: Yong Liu
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