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Most popular at the top
- Artech House 2007; US$ 105.00
Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based... more...
- CRC Press 2006; US$ 194.95
Digital Microfluidic Biochips focuses on the automated design and production of microfluidic-based biochips for large-scale bioassays and safety-critical applications. Bridging areas of electronic design automation with microfluidic biochip research, the authors present a system-level design automation framework that addresses key issues in the design,... more...
- CRC Press 2011; US$ 167.95
Microfluidics-based biochips combine electronics with biochemistry, providing access to new application areas in a wide variety of fields. Continued technological innovations are essential to assuring the future role of these chips in functional diversification in biotech, pharmaceuticals, and other industries. Revolutionary guidance on design,... more...
- Artech House 2010; US$ 109.00
Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis... more...
- Springer New York 2012; US$ 96.55
This book provides a thorough methodology for automated design, test and diagnosis, and use of robust, low-cost, and manufacturable digital microfluidic systems. It focuses on the development of a CAD optimization framework for digital microfluidic biochips. more...
- Springer International Publishing 2013; US$ 96.55
This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective. more...
- Springer International Publishing 2017; US$ 80.45
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test... more...
- CRC Press 2013; US$ 80.00
Advances in design methods and process technologies have resulted in a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. Testing for Small-Delay Defects in Nanoscale... more...
- CRC Press 2002; US$ 209.95
Composite systems that integrate microelectromechanical and microelectrofluidic (MEF) components with electronics are emerging as the next generation of system-on-a-chip (SOC) designs. However, there remains a pressing need for a structured methodology for MEFS design automation, including modeling techniques and simulation and optimization tools.... more...
- Springer New York 2011; US$ 96.55
This book introduces new techniques for detecting and diagnosing small-delay defects in integrated circuits. It details effective and scalable methodologies for screening and diagnosing small-delay defects. more...