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- Springer Singapore 2016; US$ 143.00
This bookconstitutes the refereed proceedings of the 7th International Symposium onIntelligence Computation and Applications, ISICA 2015, held in Guangzhou,China, in November 2015. The 77revised full papers presented were carefully reviewed and selected from 189submissions. The papers feature the most up-to-date research in analysis andtheory of... more...
- BRILL 2006; US$ 116.00
This case study of the tea trade of the Dutch East India Company with China deals with the most profitable phase of the Dutch Company?s China trade, focusing on the question why and how the tea trade was taken out of the hands of the High Government in Batavia and put under the supervision of the newly established China Committee in 1757. Various factors... more...
- Springer New York 2012; US$ 269.00
This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. more...
- Wiley 2011; US$ 154.95
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution.... more...
- Springer International Publishing 2015; US$ 84.00
This book constitutes the refereed proceedings of the 16th International Conference on Passive and Active Measurement, PAM 2015, held in New York, NY, USA, in March 2015. The 27 full papers presented were carefully reviewed and selected from 100 submissions. The papers have been organized in the following topical sections: DNS and Routing, Mobile and... more...
- Springer London 2009; US$ 109.00
This book is devoted to a comprehensive treatment of this important field, a grand challenge for future networking research. It covers results from the authors as well as other researchers. Topics covered include Independent Case Analysis and its applications. more...
- Springer New York 2014; US$ 119.00
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers... more...
- Springer Berlin Heidelberg 2012; US$ 139.00
This book constitutes the refereed proceedings of the 6th International Symposium on Intelligence Computation and Applications, ISICA 2012, held in Wuhan, China, in October 2012. The 72 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers are organized in topical sections on artificial life, adaptive... more...
- Wiley 2011; US$ 151.00
The book that looks at mercury's impact on the planet today Recent research by the EPA has concluded that one in six women of childbearing age have unsafe levels of mercury in their bodies, which puts 630,000 newborn babies each year at risk of neurological impairment. Mercury poses severe risks to the health of animals and ecosystems around the... more...
- Springer Berlin Heidelberg 2011; US$ 129.00
This title introduces the hierarchical structure, principles, applications, kernel, shells, development and management of UNIX operation systems. It clarifies the bond between UNIX implementation and general operating system and software engineering theories. more...