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- Cambridge University Press 2015; US$ 72.00
Discover cutting-edge techniques for next-generation integrated circuit design, and learn how to deliver improved speed, density, power, and cost. more...
- McGraw-Hill Education 2012; US$ 130.00
Complete coverage of power line design and implementation "This text provides the essential fundamentals of transmission line design. It is a good blend of fundamental theory with practical design guidelines for overhead transmission lines, providing the basic groundwork for students as well as practicing power engineers, with material generally... more...
- McGraw-Hill Education 2012; US$ 63.00
Diagnose and repair home appliances and air conditioners using the latest techniques "The book has it all...written by a pro with 40 years of hands-on repair and teaching experience...this book is like brain candy"--GeekDad (Wired.com) Fully updated for current technologies and packed with hundreds of photos and diagrams, this do-it-yourself guide... more...
- McGraw-Hill Education 2011; US$ 130.00
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and... more...
- Wiley 2008; US$ 192.99
Mark G. Karpovsky, PhD , is Professor of Computer Engineering at the College of Engineering and Director of Reliable Computing Laboratory, both at Boston University. Dr. Karpovsky authored the classic reference Finite Orthogonal Series in the Design of Digital Devices (Wiley). He has published more than 150 research papers and several books on the... more...
- Wiley 2011; US$ 80.00
The fabrication of an integrated circuit requires a variety of physical and chemical processes to be performed on a semiconductor substrate. In general, these processes fall into three categories: film deposition, patterning, and semiconductor doping. Films of both conductors and insulators are used to connect and isolate transistors and their components.... more...
- World Scientific Publishing Company 2009; US$ 127.00
This book is the first to give an authoritative and comprehensive account of the invention of Integrated Circuits (ICs) from an insider who had participated and contributed from the beginning of their invention and advancement to the Ultra Large Scale ICs (ULSICs) of today. It reads like a mystery novel to engross the reader, but it is not based on... more...
- Springer US 2009; US$ 149.00
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments... more...
- Wiley 2011; US$ 154.95
In Optoelectronic Integrated Circuit Design and Device Modeling, Professor Jianjun Gao introduces the fundamentals and modeling techniques of optoelectronic devices used in high-speed optical transmission systems. Gao covers electronic circuit elements such as FET, HBT, MOSFET, as well as design techniques for advanced optical transmitter and receiver... more...
- Springer New York 2010; US$ 149.00
This volume presents a new exploration environment for mesh-based, heterogeneous FPGA architectures. Readers will find a description of state-of-the-art techniques for reducing area requirements, which both increase performance and enable power reduction. more...