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- Elsevier Science 2012; US$ 72.95
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatings-- including optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume... more...
- Springer International Publishing 2016; US$ 99.00
This book focuses on domain-specific heterogeneous reconfigurable architectures, demonstrating for readers a computing platform which is flexible enough to support multiple standards, multiple modes, and multiple algorithms. The content is multi-disciplinary, covering areas of wireless communication, computing architecture, and circuit design. The... more...
- Springer International Publishing 2013; US$ 54.99
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution.... more...
- Springer Berlin Heidelberg 2012; US$ 139.00
This book surveys modeling and implementation of high performance current-steering D/A-converters for digital transceivers in nanometer CMOS technology. Covers performance limitations and offers four current-steering DAC designs in standard 130 nm CMOS. more...
- McGraw-Hill Education 2012; US$ 166.00
The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by... more...
- World Scientific Publishing Company 2006; US$ 102.00
This book explores the unique advantages and large inherent transmission capacity of optical fiber communication systems. The long-term and high-risk research challenges of optical transceivers are analyzed with a view to sustaining the seemingly insatiable demand for bandwidth. A broad coverage of topics relating to the design of high-speed optical... more...
- CRC Press 2010; US$ 121.95
With the ability to improve performance, reduce fabrication costs, and increase integration levels of both RX and TX sections of the RF/mm-wave front-end, passive inductive components have experienced extraordinary growth in ICs. Therefore, a fundamental understanding of monolithic inductors and transformers has become essential for all process engineers... more...
- CRC Press 2014; US$ 187.95
From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics... more...