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  • 100 Years of Radarby Gaspare GALATI

    Springer International Publishing 2015; US$ 120.91

    This book outlines developments in radar and its applications during the past 100 years. It examines the entire historical period up to the present day and includes documentation of all significant events as well as more than 250 photos and drawings. more...

  • 1V CMOS Gm-C Filtersby Tien-Yu Lo; Chung-Chih Frank Hung

    Springer Netherlands 2009; US$ 131.90

    This text discusses the design of transconductor and Gm-C filter circuits, especially 1V circuit implementations. It emphasizes high linearity voltage-to-current blocks for wireless and wireline applications. Designs cover up to very high speed specifications. more...

  • 2-D Electromagnetic Simulation of Passive Microstrip Circuitsby Alejandro D. Jimenez

    CRC Press 2008; US$ 188.95

    Global Demand for Streamlined Design and Computatio n The explosion of wireless communications has generated a tidal wave of interest and development in computational techniques for electromagnetic simulation as well as the design and analysis of RF and microwave circuits. Learn About Emerging Disciplines, State-of-the-Art Methods 2-D Electromagnetic... more...

  • 3-Dimensional VLSIby Yangdong Deng; Wojciech P. Maly

    Springer Berlin Heidelberg 2010; US$ 120.91

    3-Dimensional VLSI presents a new integration scheme designed for problems that are difficult to solve with traditional non-monolithic integration schemes. Major 3-D VLSI design issues are also introduced, within an integrated framework. more...

  • 30 Arduino Projects for the Evil Genius, Second Editionby Simon Monk

    McGraw-Hill Education 2013; US$ 25.00 US$ 20.50

    So Many Fiendishly Fun Ways to Use the Latest Arduino Boards! Fully updated throughout, this do-it-yourself guide shows you how to program and build fascinating projects with the Arduino Uno and Leonardo boards and the Arduino 1.0 development environment. 30 Arduino Projects for the Evil Genius , Second Edition, gets you started right away with... more...

  • 30 BeagleBone Black Projects for the Evil Geniusby Christopher Rush

    McGraw-Hill Education 2014; US$ 25.00 US$ 20.50

    Fiendishly Fun Ways to Use the BeagleBone Black! This wickedly inventive guide shows you how to program and build fun and fascinating projects with the BeagleBone Black. You?ll learn how to connect the BeagleBone Black to your computer and program it, quickly mastering BoneScript and other programming tools so you can get started right away. 30... more...

  • 3D Flash Memoriesby Rino Micheloni

    Springer Netherlands 2016; US$ 95.62

    This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon.  It describes their working principles, device architectures, fabrication techniques and practical implementations,... more...

  • 3D IC Stacking Technologyby Banqiu Wu; Ajay Kumar; Sesh Ramaswami

    McGraw-Hill Education 2011; US$ 135.00 US$ 118.13

    The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and... more...

  • 3D Integration for NoC-based SoC Architecturesby Abbas Sheibanyrad; Frédéric Pétrot; Axel Jantsch

    Springer New York 2010; US$ 142.89

    3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. more...

  • 3D Stacked Chipsby Ibrahim (Abe) M. Elfadel; Gerhard Fettweis

    Springer International Publishing 2016; US$ 87.93

    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some... more...