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"Einstieg in Systems Engineering - Optimale nachhaltige Lösungen entwickeln und umsetzen", 3rd Edition. And three cases from: Rainer Züst, Peter Troxler (Hrsg.): SE Case Book, Orell Füssli Verlag AG, Zürich, Switzerland, 2002.Springer Netherlands 2006; US$ 159.00
Successful project design by using Systems Engineering Systematic way of thinking in the early project phases Easy understandable guide with questions and recommendations Clear structure of the problem solving process Integration in management structures more...
- Springer 2014; US$ 29.99
Dieses Ubungsbuch enthalt vollstandig durchgerechnete Aufgaben aus der Halbleiter-Schaltungstechnik. Es werden die Themen Halbleiterphysik, Bauelemente, Verstarker- und Logikschaltungen sowie der Entwurf integrierter Schaltungen abgedeckt. Anhand ausgewahlter Aufgaben erkennt der Leser die Vorgehensweise bei der Losung von Problemen aus den verschiedenen... more...
- Springer 2009; US$ 189.00
Discusses the design aspects of transconductor and Gm-C filter circuits, with a focus on 1V circuit implementations. This work emphasizes on high linearity voltage-to-current blocks for wireless and wireline applications. It provides an introduction to low voltage architectures and offers an insight into the influence of circuit non-idealities. more...
- CRC Press 2008; US$ 188.95
Methods of Electromagnetic Simulation Two- and Three-Dimensional FDTD Models The Method of Moments The Basic Concept Some Circular Geometries Analysis of Passive Microstrip Circuits The Equivalent Circuit of a Uniform Transmission Line The Analysis of Some Microstrip Passive Test Circuits The Finite-Difference Time-Domain... more...
- Springer 2010; US$ 159.00
"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces... more...
- McGraw-Hill Education 2013; US$ 25.00
Dr. Simon Monk has a degree in Cybernetics and Computer Science and a PhD in Software Engineering. He spent several years as an academic before he returned to industry, co-founding the mobile software company Momote Ltd. Simon is the author of the bestselling Programming Arduino , as well as 15 Dangerously Mad Projects for the Evil Genius , and... more...
- McGraw-Hill Education 2014; US$ 25.00
Christopher Rush (Preston, UK) has a degree in Computer Network Technology and has spent the last 10 years working for Premier Farnell (CPC), an electronic distribution company. He also runs a MakerSpace blog and blogs regularly on the Element14 Community page for BeagleBone Black. more...
- McGraw-Hill Education 2011; US$ 130.00
Chapter 1. Introduction to High-Density Through Silicon Stacking Technology Chapter 2. A Practical Design Eco-System for Heterogeneous 3D IC Products Chapter 3. Design Automation and TCAD Tool Solutions for Through Silicon Via-Based 3D IC Stack Chapter 4. Process Integration for TSV Manufacturing Chapter 5. High-Aspect-Ratio Silicon Etch for TSV... more...
- Springer 2010; US$ 179.00
This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers... more...
- Springer New York 2011; US$ 119.00
Provides a vivid, internal view of semiconductor devices, through 3D TCAD simulation Includes comprehensive coverage of TCAD simulations for both optic and electronic devices, from nano-scale to high-voltage high-power devices Presents material in a hands-on, tutorial fashion so that industry practitioners will find maximum utility Includes... more...