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Materials of engineering and construction. Mechanics of materials

  • Advanced Dynamics and Model-Based Control of Structures and Machinesby

    Springer Vienna 2011; US$ 129.00

    Based on a Russian-Austrian Joint Workshop held in Linz, Austria, in April 2010, this volume presents up-to-date research in nonlinear control of structures and systems, sensing and actuation, active and passive damping, nano- and micromechanics, and vibrations and waves. more...

  • Fracture and Fatigue, Volume 7by

    Springer International Publishing 2013; US$ 199.00

    Fracture and Fatigue, Volume 7: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics , the seventh volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microstructural... more...

  • Innovations in Bio-inspired Computing and Applicationsby

    Springer International Publishing 2013; US$ 199.00

    This volume of Advances in Intelligent Systems and Computing contains accepted papers presented at IBICA2013, the 4th International Conference on Innovations in Bio-inspired Computing and Applications. The aim of IBICA 2013 was to provide a platform for world research leaders and practitioners, to discuss the full spectrum of current theoretical developments,... more...

  • Materials for Tomorrowby

    Springer Berlin Heidelberg 2007; US$ 209.00

    Materials science has assumed a key position for new technological dev- opments, and is therefore strongly supported by industry and governments. Nowadays it occupies a bridging position between physics, chemistry and - gineering and extends from basic science in physics and chemistry on the atomic scale to large-scale applications in industry. The... more...

  • Wafer Level 3-D ICs Process Technologyby

    Springer US 2009; US$ 209.00

    This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts... more...

  • Damage Mechanics and Micromechanics of Localized Fracture Phenomena in Inelastic Solidsby

    Springer Vienna 2012; US$ 249.00

    This book resulted from a series of lecture notes presented in CISM, Udine in July 2008. It explores recent advances in continuum damage mechanics for both metals and metal matrix composites as well as the micromechanics of localization in inelastic solids. more...

  • Semiconductor Nanostructures for Optoelectronic Devicesby

    Springer Berlin Heidelberg 2012; US$ 149.00

    This book summarizes the current state of semiconductor nanodevice development, examining nanowires, nanorods, hybrid semiconductor nanostructures, wide bandgap nanostructures for visible light emitters and graphene and describing their device applications. more...

  • Fiber Reinforced Polymer (FRP) Composites for Infrastructure Applicationsby

    Springer Netherlands 2012; US$ 209.00

    This overview examines current issues of fiber reinforced polymer (FRP) composites in civil infrastructure. Part I engages topics related to durability and service life of FRP composites, and how they contribute to sustainability, while Part II highlights implementation and applications. more...

  • Application of Super Absorbent Polymers (SAP) in Concrete Constructionby

    Springer Netherlands 2012; US$ 129.00

    This comprehensive, state-of-the-art report explores the properties of Super Absorbent Polymers (SAP), reviews key advantages of using SAP, and describes the first existing application of this new concrete additive, as well as many prospective applications. more...

  • Femtosecond Laser Micromachiningby

    Springer Berlin Heidelberg 2012; US$ 249.00

    This book describes state-of-the-art micromachining of transparent materials which, due to the nonlinear absorption mechanism of ultrashort pulses, allows unique three-dimensional capabilities and is exploitable for fabrication of complex microsystems. more...