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Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies by Karl J. Puttlitz
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This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
CRC Press; February 2004
1044 pages; ISBN 9780203021484
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Title: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
Author: Karl J. Puttlitz; Kathleen A. Stalter
 
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