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Electrothermal Analysis of VLSI Systems

Electrothermal Analysis of VLSI Systems by Yi-Kan Cheng; Ching-Han Tsai; Chin-Chi Teng; Sung-Mo (Steve) Kang
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Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Springer US; May 2007
235 pages; ISBN 9780306470240
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Title: Electrothermal Analysis of VLSI Systems
Author: Yi-Kan Cheng; Ching-Han Tsai; Chin-Chi Teng; Sung-Mo (Steve) Kang
 
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ISBNs
0306470241
9780306470240
9780792378617