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Three-Dimensional Integration of Semiconductors

Processing, Materials, and Applications

Three-Dimensional Integration of Semiconductors by Kazuo Kondo
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US$ 169.00
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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Springer International Publishing; December 2015
423 pages; ISBN 9783319186757
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Title: Three-Dimensional Integration of Semiconductors
Author: Kazuo Kondo; Morihiro Kada; Kenji Takahashi
 
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