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3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

3D Stacked Chips by Ibrahim (Abe) M. Elfadel
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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Springer International Publishing; May 2016
354 pages; ISBN 9783319204819
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Title: 3D Stacked Chips
Author: Ibrahim (Abe) M. Elfadel; Gerhard Fettweis
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