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Handbook of Semiconductor Interconnection Technology, Second Edition

Handbook of Semiconductor Interconnection Technology, Second Edition by Geraldine Cogin Shwartz
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First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.

What's in thisĀ Edition:

  • Detailed discussion of electrochemical equipment for plating copper
  • Information on tools used for evaporation, chemical vapor deposition, and plasma processes
  • Emphasis on measurement of mechanical and thermal properties of insulators
  • Methods for characterizing porous dielectric thin films
  • Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides
  • Process schemes based on the increased need for borderless contact gates and source/drain
  • Expanded discussion on choices for low-dielectric insulators
  • Concentration on electroplated copper, especially morphology of plated films and their properties
  • Developments in thin film liners and barriers
  • Expanded material on copper reliability
  • CRC Press; February 2006
    533 pages; ISBN 9781420017656
    Read online, or download in secure PDF format
    Title: Handbook of Semiconductor Interconnection Technology, Second Edition
    Author: Geraldine Cogin Shwartz; Geraldine C. Schwartz; Kris V. Srikrishnan
     
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