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Fundamentals of Microsystems Packaging

Fundamentals of Microsystems Packaging by Rao Tummala
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LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP

Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find:


*Full coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing

McGraw-Hill Education; May 2001
978 pages; ISBN 9780071418072
Read online, or download in secure PDF format
Title: Fundamentals of Microsystems Packaging
Author: Rao Tummala
 
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