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Materials for Advanced Packaging

by Daniel Lu(ed.) ; C.P. Wong(ed.)
Materials for Advanced Packaging by Daniel Lu
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US$ 259.00
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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Springer International Publishing; November 2016
974 pages; ISBN 9783319450988
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Title: Materials for Advanced Packaging
Author: Daniel Lu; C.P. Wong
 
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