An Introduction to Microelectromechanical Systems Engineering (2nd ed.)

Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list.

With an emphasis on commercialized products, thisunique resource helps you determine whether your application can benefit from aMEMS solution, understand how other applications and companies have benefitedfrom MEMS, and select and define a manufacturable MEMS process for yourapplication. You discover how to use MEMS technology to enable newfunctionality, improve performance, and reduce size and cost. The book teachesyou the capabilities and limitations of MEMS devices and processes, and helpsyou communicate the relative merits of MEMS to your company’s management. Fromcritical discussions on design operation and process fabrication of devices andsystems, to a thorough explanation of MEMS packaging, this easy-to-understandbook clearly explains the basics of MEMS engineering, making it an invaluablereference for your work in the field.

Contents:

MEMS: A Technology from Lilliput - The Promise ofTechnology. What are MEMS? What is Micromachining? Applications and Markets. ToMEMS or not to MEMS. Standards. The Psychological Barrier. Journals, Conferences,and Web Sites.

The Sandbox: Materials for MEMS - Silicon Materials.Other Materials and Substrates. Important Material Properties and PhysicalEffects.

The Toolbox: Processes for Micromachining - BasicProcess Tools. Advanced Process Tools. Combining the Tools.

MEM Structure and Systems in Industrial and AutomotiveApplications - General Design Methodology. Techniques for Sensing andActuation. Passive MEM Structures. Sensors. Actuators.

MEM Structures and Systems for Photonic Applications- Imaging and Displays. Fiber-Optic Communication Devices.

MEM Structures and Systems for Medical Applications.

MEM Structures and Systems for Electronic and RFApplications.

Packaging & Reliability for MEMS - Key Design andPackaging Considerations. Die-Attach Processes. Wiring and Interconnects. Typesof Packaging Solutions. Reliability and Failure Analysis.

Glossary.

NadimMaluf is vice president of New Focus, Inc. and a consulting professor of electricalengineering at Stanford University. Prior to joining New Focus, he was head ofresearch and development at NovaSenor. A best-selling author in the area ofMEMS technology, Dr. Maluf earned his Ph.D. in electrical engineering atStanford University and his M.S. in electrical engineering at the CaliforniaInstitute of Technology.

KirtWilliams is a senior scientist at Science Applications International Corporation. Formerly, he was a member of the technical staff at Agilent Technologies and at NovaSensor. He received his Ph.D. and M.S. in electrical engineering from the University of California at Berkeley. He is the author of numerous papers on MEM devices and fabrication processes.