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  • The Dutch East India Company's Tea Trade with China, 1757-1781by Yong LIU

    BRILL 2006; US$ 116.00

    This case study of the tea trade of the Dutch East India Company with China deals with the most profitable phase of the Dutch Company’s China trade, focusing on the question why and how the tea trade was taken out of the hands of the High Government in Batavia and put under the supervision of the newly established China Committee in 1757. Various factors... more...

  • Power Electronic Packagingby Yong Liu

    Springer New York 2012; US$ 187.08

    This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field. more...

  • 3D Cinematic Aesthetics and Storytellingby Yong Liu

    Springer International Publishing 2018; US$ 70.15

    This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since Avatar  (2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular graphics and considers how 3D can be used to enhance... more...

  • Stochastic Network Calculusby Yuming Jiang; Yong Liu

    Springer London 2009; US$ 78.33

    This book is devoted to a comprehensive treatment of this important field, a grand challenge for future networking research. It covers results from the authors as well as other researchers. Topics covered include Independent Case Analysis and its applications. more...

  • Modeling and Simulation for Microelectronic Packaging Assemblyby Sheng Liu; Yong Liu

    Wiley 2011; US$ 143.96

    Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution.... more...

  • Wafer-Level Chip-Scale Packagingby Shichun Qu; Yong Liu

    Springer New York 2014; US$ 97.04

    Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers... more...

  • Passive and Active Measurementby Jelena Mirkovic; Yong Liu

    Springer International Publishing 2015; US$ 58.45

    This book constitutes the refereed proceedings of the 16th International Conference on Passive and Active Measurement, PAM 2015, held in New York, NY, USA, in March 2015. The 27 full papers presented were carefully reviewed and selected from 100 submissions. The papers have been organized in the following topical sections: DNS and Routing, Mobile and... more...

  • UNIX Operating Systemby Yukun Liu; Yong Yue; Liwei Guo

    Springer Berlin Heidelberg 2011; US$ 101.72

    This title introduces the hierarchical structure, principles, applications, kernel, shells, development and management of UNIX operation systems. It clarifies the bond between UNIX implementation and general operating system and software engineering theories. more...

  • Current Geotechnical Engineering Aspects of Civil Infrastructuresby Meng-Chia Weng; Jeffrey Lee; Yong Liu

    Springer International Publishing 2018; US$ 128.61

    This book deals with the attempts made by the scholars and engineers to address contemporary issues in geotechnical engineering such as characterization of geomaterials, slope stability and tunneling, sustainability in geohazards and some other geotechnical issues that are becoming quite relevant in today's world. With increasing urbanization rates... more...

  • Quality of Service in Optical Burst Switched Networksby Kee Chaing Chua; Mohan Gurusamy; Yong Liu; Minh Hoang Phung

    Springer US 2007; US$ 140.31

    Optical Burst Switching (OBS) offers a promising switching technique to support huge bandwidth requirements in optical backbone networks that use Wavelength Division Multiplexing. This book details the quality of service (QoS) issue in OBS networks. more...